Opportunity timeline
In plain English
DARPA DSO is seeking foundational thermal-management mechanisms that could overcome legacy thermodynamic limits across different Department of Defense applications. It is not seeking modular, integrated cooling packages. Submissions are reviewed on a rolling basis under DARPA-PS-25-05.
About this opportunity
DARPA DSO will be actively “shopping” the ERIS Marketplace for game-changing, foundational mechanisms—rather than modular, integrated cooling packages—capable of fundamentally disrupting legacy thermodynamic limits across diverse DoD application spaces. This is an active and immediate search for solutions. Submissions will be reviewed on a rolling basis in accordance with the procedures set forth in DARPA-PS-25-05.
Time remaining
Closes Sep 30, 2026
Related Opportunities

2026 Request for White Papers: NASA SBIR/STTR Phase II Sequential Awards

Next Generation Hypersonic Cruise Missile Industry Day

ManTech sBAA

Secure Packaged Microelectronic Components, Printed Circuit Boards, and Supporting Technologies

Broad Agency Announcement (BAA): Cost Estimating Modeling Data, Analytics Research (CEMDAR)
Bid details are gathered and summarized automatically. Please verify details at the original source.
Ref No.
BS-016268

