Opportunity timeline

PostedAug 18, 2026
DeadlineSep 16, 2026

In plain English

The U.S. Army is seeking information from domestic vendors and vendor teams about technologies that protect packaged microelectronic components used in current and future military systems. Areas of interest include board-level and package security, enhanced secure boot, secure components, multi-chip packaging, and other emerging protection technologies. This is market research, not a purchase order, and no response date is provided in the description.

About this opportunity

Information Requested: The U.S. Army Combat Capabilities Development Command Aviation and Missile Center (DEVCOM AvMC), Redstone Arsenal, AL is conducting market research to identify domestic products, suppliers, designers and manufacturers of advanced protection architectures, systems, components, and other technologies for packaged microelectronics intended for deployment into current and future military systems of interest to the Department of Defense (DoD). This RFI is seeking information from suitable vendors/vendor teams related to the following Technology Areas: 1. Board-level Security: Capabilities spanning microelectronic components and portable soft IP integrated with…

Time remaining

Closes Sep 16, 2026

02Days
:
16Hours
:
40Min
:
28Sec

Related Opportunities

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Ref No.

BS-A1AC6C