Opportunity timeline
In plain English
The U.S. Army is seeking information from domestic vendors and vendor teams about technologies that protect packaged microelectronic components used in current and future military systems. Areas of interest include board-level and package security, enhanced secure boot, secure components, multi-chip packaging, and other emerging protection technologies. This is market research, not a purchase order, and no response date is provided in the description.
About this opportunity
Information Requested: The U.S. Army Combat Capabilities Development Command Aviation and Missile Center (DEVCOM AvMC), Redstone Arsenal, AL is conducting market research to identify domestic products, suppliers, designers and manufacturers of advanced protection architectures, systems, components, and other technologies for packaged microelectronics intended for deployment into current and future military systems of interest to the Department of Defense (DoD). This RFI is seeking information from suitable vendors/vendor teams related to the following Technology Areas: 1. Board-level Security: Capabilities spanning microelectronic components and portable soft IP integrated with…
Time remaining
Closes Sep 16, 2026
Related Opportunities

Illumina DRAGEN Tier 3 Throughput License and v4 Server

Emergent Drug Panel-Version 2 (EDP-V2) Kit

Medicinal Chemistry Support Program for Therapeutic Development (MCSP)

Medicinal Chemistry Support Program for Therapeutic Development (MCSP)

Health Advisory Committees Research and Support
Bid details are gathered and summarized automatically. Please verify details at the original source.
Ref No.
BS-A1AC6C

