Information Technology NY
Opportunity timeline
PostedSep 8, 2026
DeadlineSep 22, 2026
In plain English
The government is seeking turnkey printed circuit board fabrication and assembly for Gen-2 BPM electronics supporting NSLS-II SR. The attached request for information contains the statement of work and instructions for obtaining project specifications and drawings.
About this opportunity
Turnkey PCB Fabrication and Assembly. *See attached RFI for statement of work and directions for obtaining project specifications/drawings.
Time remaining
Closes Sep 22, 2026
08Days
:04Hours
:17Min
:15Sec
Related Opportunities
Bid details are gathered and summarized automatically. Please verify details at the original source.
Ref No.
BS-1E0605


