Bid guide
How to bid on Semiconductor Device Assembly (Diode Box) for the DLA
What the DLA is buying and why it matters
The Defense Logistics Agency (DLA) is seeking a one-time purchase of Semiconductor Device Assemblies, also known as Diode Boxes. These components are identified by NSN 5961-01-522-9461CX and PN 816-3385-001. These assemblies are crucial for providing electrical isolation between various components on KC-135 and similar aircraft.
The contract requires two first-article units for testing, followed by 68 production units upon approval of the first articles. This is an opportunity for manufacturers of specialized electronic components to supply directly to the Department of Defense.
Key dates and what happens at the deadline
This Request for Information (RFI) was published on July 21, 2026. Responses are due by August 05, 2026, at 5:00 PM ET. All submissions must be received by this deadline.
The DLA anticipates awarding the contract on or before September 30, 2026. The period of performance for the awarded contract will run through September 2027. Delivery is to SW3119, with F.O.B. Origin terms.
Who this opportunity suits
This opportunity is suitable for businesses specializing in the manufacturing of semiconductor devices, particularly those with experience in producing assemblies for aerospace or defense applications. Firms capable of meeting specific technical specifications for electronic components used in aircraft like the KC-135 would be a good fit.
The solicitation is categorized under technology, indicating a need for specialized manufacturing and quality control processes for electronic hardware.
How to respond to this solicitation
To access the full details of this opportunity, you will need to view the original source on the government portal. Click the “View original source” link. If the first click takes you to the portal’s homepage, click the link a second time to go directly to the bid.
You may need to create a free account on the portal to view all associated documents, though for some bids, documents are publicly accessible without an account. Technical data will be provided to responsible, interested parties upon request.
Practical tips for a competitive response
When preparing your response, focus on demonstrating your firm's capability to manufacture the Semiconductor Device Assemblies precisely to the required specifications. Highlight any relevant experience with similar components or defense contracts.
Clearly outline your plan for producing both the first-article units and the full production quantity, including your quality control processes. Since technical data is available upon request, ensure you obtain and review it thoroughly to understand all manufacturing and testing requirements before submitting your response.
See the live bid — deadline, agency details, and how to respond
Dates and requirements can change via addenda; always verify on the bid page and at the original source before responding.
View this bid on BiddingSimpleThis guide was prepared by BiddingSimple from the solicitation’s public posting. It is not official guidance from Defense Logistics Agency; the original posting controls.