Bid guide

How to bid on Rapid Assured Access (R2A) for Defense Microelectronics Activity (DMEA)

Defense Microelectronics Activity (DMEA) CACloses August 6, 2026

What DMEA is buying and why it matters

The Defense Microelectronics Activity (DMEA) is seeking rapid, long-term assured access to semiconductor foundry and microelectronics manufacturing services. This is for the Rapid Assured Access (R2A) program, which supports Department of Defense (DoD) programs and defense contractors.

DMEA plans to establish multiple single-award indefinite delivery, indefinite quantity (IDIQ) contracts. The goal is to meet the government's technology needs and ensure assured access for developing DoD programs. This opportunity is significant for manufacturers in the microelectronics sector.

Key dates and what happens at the deadline

The deadline for proposals is August 6, 2026, at 2:00 PM PST (5:00 PM ET). All proposals must be submitted by this time.

The last day to submit questions for this solicitation was July 13, 2026. No further questions will be accepted.

Who this opportunity suits

This opportunity is suitable for semiconductor foundry and microelectronics manufacturing firms. It is categorized as a professional service. Companies that can provide rapid and assured access to microelectronics manufacturing, regardless of project size and classification, are encouraged to respond.

The program aims to establish an 'on-ramp' for additional vendors as needed to mitigate future technology gaps, indicating a long-term need for qualified manufacturers.

How to respond to this solicitation

To access the solicitation documents, you need to click the 'View original source' link. If the first click takes you to the portal's homepage, click the link again to go directly to the bid.

You may need a free account on the portal to view all the documents. However, for many bids, you can view documents without an account.

Tips for preparing a competitive response

Carefully review all attachments, especially Amendment #4 which added Attachment 2 - Section L (Instructions Conditions Notices to Offerors or Quoters R1) and Attachment 3 - Section M (Evaluation Factors for Award R2). These sections contain critical information on how your proposal will be evaluated and what instructions you must follow.

Ensure your proposal clearly addresses how your firm can provide rapid, long-term assured semiconductor foundry access. Highlight your capabilities in microelectronics manufacturing and your ability to support various project sizes and classifications. Since the agency seeks multiple single-award IDIQs, focus on demonstrating your unique value and reliability.

See the live bid — deadline, agency details, and how to respond

Dates and requirements can change via addenda; always verify on the bid page and at the original source before responding.

View this bid on BiddingSimple

This guide was prepared by BiddingSimple from the solicitation’s public posting. It is not official guidance from Defense Microelectronics Activity (DMEA); the original posting controls.